Microelectronics Advanced Packaging Engineer
Why this job is listed
“Ability to obtain a Secret clearance”
Verbatim from the original posting (re-verified against the source text).
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…terial selection for panel-level, wafer-level, and chip-level systems Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration Ability to obtain a Secret clearance Bachelor's degree in an Engineering field Nice If You Have: 5+ years of experience with advanced packaging technology innovation and prototyping Experience collaborating with RF, digital, photonics, and analog design…
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